VertaCure XP G2
General information
A fully automated vacuum cure system, equipped with a five-zone uniform temperature control.
The single-step process enables short cure times and high throughput while delivering superior mechanical, thermal and electrical properties for a large variety of polyimide FO and passivation applications.
Offering 200 and 300 mm wafer compatibility, which is HVM proven performance at the world’s leading semiconductor fabs.
Datasheet & Specs
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Values
Laminar flow technology
Provides superior particle performance
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Short cure time
Increases the throughput and throughput density, reducing the cost of ownership
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Protects vacuum lines
Built-in condensate trap protects vacuum lines, valves, and vacuum pump from solvent condensates
Applications
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Polyimide, PBO, and epoxy cure
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Lower pressure polymer cure
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Photoresist cure
Other products
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