VeroTherm FAR XP

Our VeroTherm FAR XP system offers high precision and tunable process control, ensuring superior yield performance with bumps as small as 7 µm tall at 12 µm pitch.

Our unique single-step process offers high throughput with no defects and a minimal inter-metallic zone of less than 1 µm.

This process is qualified at the world’s largest IDM & HBM manufacturers, guaranteeing industry-leading reliability and efficiency.

Wafers

Runs two wafer sizes in parallel in large batch sizes.

Panels

Handles 510 × 515 mm dimensions down to 200 µm 
thickness without breakage.

Copper Eless

Efficient electroless plating of copper for both surface bonding and glass core liner.

Values

Optimal on-board chemical management

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Specialized handling with panel shock

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High throughput / low COO

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Applications

Glass Etch

Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.

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Applications

ENEPIG / ENIG

Electroless plating processes for enhanced bonding in advanced packaging.

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Applications

Metal Etch

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

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Applications

Standard Cleans

Metal etch capability for Cu, Ti, TiW, Ru, and more.

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Applications

Other

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Applications

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Values

High yield reflow performance

Single wafer vacuum reflow architecture enables excellent process sensitivity and control.

Lower cost of ownership

Single step process enables high throughput with high yield and a small footprint.

Technology
extendibility

Able to process 7 µm bump at 12 µm pitch.

Applications

Solder Reflow – C4 bumps, Cu pillar

Chip-to-wafer and wafer-to-wafer bonding reflow

Thin die stacking reflow

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