VertaCure PLP

Our VertaCure PLP is a panel-based vacuum curing system that is modular in design. It is fully automated and provides complete curing of polyimides and ABF.

It offers uniform temperature distribution, and precise management of heating and cooling rates.

There is no outgassing after cure, better thermal, mechanical and electrical properties, and excellent particle performance.

Wafers

Runs two wafer sizes in parallel in large batch sizes.

Panels

Handles panel dimensions down to 200 μm thickness without breakage.

Copper Eless

Efficient electroless plating of copper for both surface bonding and glass core liner.

Values

Optimal on-board chemical
management

Specialized handling with panel shock

Low COO with high throughput

Applications

Via liner

Build-up layers

Interconnects

Glass Etch

Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.

Values

Specialized glass panel handling

Optimized chemical usage

Onboard analysis and metrology

Applications

Through glass via etch

Glass cavity etch for embedded devices

ENEPIG / ENIG

Electroless plating processes for enhanced bonding in advanced packaging.

Values

Optimal on-board chemical management

Specialized handling with panel shock

Low COO with high throughput

Applications

Final layer interface for bonding

Extends package lifetime

Protects copper layers from oxidation

Metal Etch

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

Multiple chemical processes available

Efficient onboard chemical management

Chemical cabinets available
for bulk chemical delivery

Applications

Seed metal etch

Standard Cleans

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

High efficiency processing

Ultrasonic and megasonic agitation available

Flexible setup for multiple processes

Applications

Front end particle cleans

Post SiC wafer cleans

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Values

Production-proven excellence

YES’s vacuum cure process shortens cure time, and provides excellent temperature uniformity

Chamber exhaust condensate trap

Protect vacuum lines, valves, and vacuum pump performance from solvent condensates

Laminar flow technology

Results in high degrees of uniformity and particle performance

Applications

Polyimide and PBO cure

Adhesion promotion

Photoresist hard bake / solder resist cure

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