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Wafers
Runs two wafer sizes in parallel in large batch sizes.
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Panels
Handles 510 × 515 mm dimensions down to 200 µm
thickness without breakage.
Copper Eless
Copper Eless
Efficient electroless plating of copper for both surface bonding and glass core liner.
Values
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Optimal on-board chemical management
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Specialized handling with panel shock
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High throughput / low COO
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Applications
Glass Etch
Glass Etch
Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.
Values
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Applications
ENEPIG / ENIG
ENEPIG / ENIG
Electroless plating processes for enhanced bonding in advanced packaging.
Values
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Applications
Metal Etch
Metal Etch
Metal etch capability for Cu, Ti, TiW, Ru, and more.
Values
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Applications
Standard Cleans
Standard Cleans
Metal etch capability for Cu, Ti, TiW, Ru, and more.
Values
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Applications
Other
Other
Values
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Applications
Applications
No items found.
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