UltraCoat

UltraCoat systems are ideal for vapor deposition applications that require the highest standards of reliability.

Designed with patented YES technologies, UltraCoat systems offer total control over process and environmental conditions, maximizing wafer coating uniformity.

Independent five-zone temperature control ensures precise uniformity throughout the chamber.

Wafers

Runs two wafer sizes in parallel in large batch sizes.

Panels

Handles 510 × 515 mm dimensions down to 200 µm 
thickness without breakage.

Copper Eless

Efficient electroless plating of copper for both surface bonding and glass core liner.

Values

Optimal on-board chemical management

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Specialized handling with panel shock

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High throughput / low COO

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Applications

Glass Etch

Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.

Values

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Applications

ENEPIG / ENIG

Electroless plating processes for enhanced bonding in advanced packaging.

Values

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Applications

Metal Etch

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

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Applications

Standard Cleans

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

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Applications

Other

Values

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Applications

Applications

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Values

High performance

Coating to 250 °C; chamber pressure 100 mTorr

Process uniformity

≤1.5% temp uniformity with 5-zone temperature control

Customizable configurations

Flexible configurations for automation and chemical delivery

Applications

Anti-stiction layers

Adhesion promotion

Surface modification

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