Wafers
Runs two wafer sizes in parallel in large batch sizes.
.png)
Panels
Handles 510 × 515 mm dimensions down to 200 µm
thickness without breakage.
Copper Eless
Copper Eless
Efficient electroless plating of copper for both surface bonding and glass core liner.
Values
.png)
Optimal on-board chemical management
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
.png)
Specialized handling with panel shock
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
High throughput / low COO
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Applications
Glass Etch
Glass Etch
Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.
Values
No items found.
Applications
ENEPIG / ENIG
ENEPIG / ENIG
Electroless plating processes for enhanced bonding in advanced packaging.
Values
No items found.
Applications
Metal Etch
Metal Etch
Metal etch capability for Cu, Ti, TiW, Ru, and more.
Values
No items found.
Applications
Standard Cleans
Standard Cleans
Metal etch capability for Cu, Ti, TiW, Ru, and more.
Values
No items found.
Applications
Other
Other
Values
No items found.
Applications
Applications
No items found.
.png)
.png)
-min.png)
-min.png)
-min.png)
