TA Series

HMDS vacuum cure / vapor prime deposition system with the highest throughput and the lowest cost of ownership.

TA series are used for HMDS coating for photoresist adhesion promotion. Systems include the 310TA (up to 200 mm wafer size, ambient up to 160 ºC) and the 58TA (up to 300 mm wafer size, ambient up to 180 ºC).

Integrated image reversal process capability.

Values

Exceptional cost of ownership

Large batch size capability and near-zero chemical waste.

High yield

Superior HMDS bond and uniformity performance results in high yield.

High reliability

>99% uptime and reliability with superior customer-proven uniformity and repeatability.

Applications

HMDS vapor deposition for photoresist adhesion

Substrate dehydration

Photoresist image reversal for metal lift-off processing

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