TA Series

HMDS vacuum cure / vapor prime deposition system with the highest throughput and the lowest cost of ownership.

TA series are used for HMDS coating for photoresist adhesion promotion. Systems include the 310TA (up to 200 mm wafer size, ambient up to 160 ºC) and the 58TA (up to 300 mm wafer size, ambient up to 180 ºC).

Integrated image reversal process capability.

Wafers

Runs two wafer sizes in parallel in large batch sizes.

Panels

Handles 510 × 515 mm dimensions down to 200 µm 
thickness without breakage.

Copper Eless

Efficient electroless plating of copper for both surface bonding and glass core liner.

Values

Optimal on-board chemical management

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Specialized handling with panel shock

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High throughput / low COO

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Applications

Glass Etch

Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.

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Applications

ENEPIG / ENIG

Electroless plating processes for enhanced bonding in advanced packaging.

Values

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Applications

Metal Etch

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

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Applications

Standard Cleans

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

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Applications

Other

Values

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Applications

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Values

Exceptional cost of ownership

Large batch size capability and near-zero chemical waste.

High yield

Superior HMDS bond and uniformity performance results in high yield.

High reliability

>99% uptime and reliability with superior customer-proven uniformity and repeatability.

Applications

HMDS vapor deposition for photoresist adhesion

Substrate dehydration

Photoresist image reversal for metal lift-off processing

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