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YES announced it has received multiple orders of its VeroTherm™ and VeroFlex™ reflow systems from a leading global memory supplier. The tools will support 3D stacking of memory and logic chips for high-performance AI accelerators, enabling sub-10 µm fluxless solder reflow with superior thermal uniformity and reliability.

These systems will be deployed in advanced semiconductor packaging for AI and HPC, enabling precise low-temperature curing, annealing, and degassing to support next-generation 2.5D and 3D packaging technologies.

These systems will be used in advanced semiconductor packaging for AI and high-performance computing, supporting low-temperature curing and annealing for next-gen Edge devices.

The emergence of AI, IoT, 6G technical demands require scaling of interconnects and the substrate that offers speed...

The roadmap for microbump reduction involves a multidisciplinary approach, incorporating materials science, process engineering...

Scaling down microbumps involves a holistic strategy—one that requires integrating expertise from materials...