Equipment solutions enabling AI

Engineering
the Intelligent
Future

Our equipment enables advanced packaging for high-performance computing and AI applications.

VeroTherm FAR

VeroTherm FAR

VeroTherm FAR
TersOnus TGV

TersOnus TGV

TersOnus TGV
VertaCure XP G2

VertaCure XP G2

VertaCure XP G2

Solutions for Advanced Packaging

1
/
6

VeroTherm FAR can be used for Solder Balls, C4 Bumps, and µBumps needed for advanced packages.

VeroTherm FARVeroTherm FAR

Solutions for Advanced Packaging

1
/
6

VertaCure offers a cure process for both build-up layers and the interposer.

VertaCureVertaCure

Solutions for Advanced Packaging

1
/
6

VertaPrime enhances the bonding needed for the build-up layers and the substrate core.

VertaPrimeVertaPrime

Solutions for Advanced Packaging

1
/
6

TersOra leverages its edge zone removal process to yield uniform edges in advanced package build-up layers.

TersOraTersOra

Solutions for Advanced Packaging

1
/
6

TersOnus TGV Etch involves precisely creating through-glass vias (TGVs) in substrates for enhanced connectivity in microelectronics.

TersOnus TGVTersOnus TGV

Solutions for Advanced Packaging

1
/
6

TersOnus Platform Electroless deposits metals critical advanced packaging build-up layers' connectivity.

TersOnus Platform ElectrolessTersOnus Platform Electroless

Solutions for Advanced Packaging

1
/
6

VeroTherm FAR can be used for Solder Balls, C4 Bumps, and µBumps needed for advanced packages.

VeroTherm FARVeroTherm FAR

Solutions for Advanced Packaging

1
/
6

VertaCure offers a cure process for both build-up layers and the interposer.

VertaCureVertaCure

Solutions for Advanced Packaging

1
/
6

VertaPrime enhances the bonding needed for the build-up layers and the substrate core.

VertaPrimeVertaPrime

Solutions for Advanced Packaging

1
/
6

TersOra leverages its edge zone removal process to yield uniform edges in advanced package build-up layers.

TersOraTersOra

Solutions for Advanced Packaging

1
/
6

TersOnus TGV Etch involves precisely creating through-glass vias (TGVs) in substrates for enhanced connectivity in microelectronics.

TersOnus TGVTersOnus TGV

Solutions for Advanced Packaging

1
/
6

TersOnus Platform Electroless deposits metals critical advanced packaging build-up layers' connectivity.

TersOnus Platform ElectrolessTersOnus Platform Electroless

Facts, numbers, and footprint

Global talent

300 employees worldwide, our staff is comprised of 220+ engineers who can deliver high-quality semiconductor products for our customers' needs.

Robust IP

With more than 100 patents, pending patents, and trade secrets, we operate on the cutting edge of technology, delivering advanced technology with our products.

Proven products

We have delivered 1,000+ tools to over 100 fabs across the world, confirming our position as an established semiconductor equipment provider.

Global Footprint

MapMap

Global Headquarters,
R&D and NPI

  • USA / Fremont, California

Wet Processing
Group

  • USA / Valencia, California

Advanced Technology
Center

  • USA / Chandler, Arizona

Engineering and R&D

  • India / Bangaluru

  • India / Coimbatore

Sales & Service

  • Taiwan / Zhubei City, Hsinchu County

  • Japan / Nakamura-ku, Nagoya, Aichi

  • South Korea / Hwaseong-si, Gyeonggi-do

  • Germany / Frankfurt

Find out more
about our solutions

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