PB Series
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General information
High temperature vacuum cure system for polyimide, photoresist and epoxy curing as well as wafer-to-wafer bonding anneal.
PB series deliver superior polymer film quality and throughput using precision temperature control. Systems include the PB8 (up to two cassettes of 200 mm wafers) and the PB12 (up to two cassettes of 300 mm wafers).
Operation up to 450 ± 5 °C temperature uniformity and two gas mixing capability.
Datasheet & Specs
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Values
Low cost of ownership
2x throughput improvement over conventional atmospheric oven with less power and N2 consumption.
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High yield
Superior chemical film properties without post-cure outgassing.
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Precise process control
Excellent temperature uniformity with low particle during curing process.
Applications
Polymer curing and outgassing
Copper annealing
Wafer-to-wafer bond annealing
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