PB Series

High temperature vacuum cure system for polyimide, photoresist and epoxy curing as well as wafer-to-wafer bonding anneal.

PB series deliver superior polymer film quality and throughput using precision temperature control. Systems include the PB8 (up to two cassettes of 200 mm wafers) and the PB12 (up to two cassettes of 300 mm wafers).

Operation up to 450 ± 5 °C temperature uniformity and two gas mixing capability.

Wafers

Runs two wafer sizes in parallel in large batch sizes.

Panels

Handles 510 × 515 mm dimensions down to 200 µm 
thickness without breakage.

Copper Eless

Efficient electroless plating of copper for both surface bonding and glass core liner.

Values

Optimal on-board chemical management

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Specialized handling with panel shock

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High throughput / low COO

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Applications

Glass Etch

Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.

Values

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Applications

ENEPIG / ENIG

Electroless plating processes for enhanced bonding in advanced packaging.

Values

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Applications

Metal Etch

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

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Applications

Standard Cleans

Metal etch capability for Cu, Ti, TiW, Ru, and more.

Values

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Applications

Other

Values

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Applications

Applications

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Values

Low cost of ownership

2x throughput improvement over conventional atmospheric oven with less power and N2 consumption.

High yield

Superior chemical film properties without post-cure outgassing.

Precise process control

Excellent temperature uniformity with low particle during curing process.

Applications

Polymer curing and outgassing

Copper annealing

Wafer-to-wafer bond annealing

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