VertaBond
General information
The YES VertaBond™ vacuum furnace provides complete, reliable wafer and panel bonding in less time with a reduced thermal budget.
Superior bond strength as well as excellent particle performance come from the VertaBond’s precise temperature uniformity in a low vacuum environment.
Innovative manufacturers utilize VertaBond for demanding 3D stacking and heterogeneous integration applications in HBM and other critical areas.
Datasheet & Specs
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Values
Void-free hybrid bonding
Bonding in less time and at lower temperatures using a vacuum
Low wafer warpage
Less film stress from vacuum anneals produces better bonding properties and less wafer warpage
Vacuum anneal
Providing Cu-Cu bonding without voids, delamination, or dishing. Enabling 6 µm pitch with no voids or bubbles
Applications
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WtW Hybrid Bonding
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DtP Bonding
PtP Bonding
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