RFS
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General information
Single-wafer precision plasma strip, descum, and cleaning system - the tool of choice at R&D labs and universities worldwide.
Hot-plate temperature up to 250 °C enables etch rate from 100 Å/min (descum) to 7,000 Å/min (strip).
Achieve higher yields and handles wafers, odd-shape substrates or pieces up to 200 mm with four gas mixing capability.
Datasheet & Specs
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Values
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High flexibility
Single wafer plasma system supports photoresist strip and descum, polyimide strip, and organic removal.
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Best-in-class uniformity and repeatability
Precision etch rate and hot-plate temperature control.
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Best choice for advanced devices
Downstream plasma configuration protects against device electrical damage.
Applications
Photoresist / polyimide removal
Residue descum
Surface cleaning and preparation
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